Components
Addressing Thermal Challenges in High‐Density Power Applications
Demand for more features and higher performance from ever-smaller form factors presents significant challenges...
From Prototype to Post Deployment: Linux Decision Points
Developing embedded solutions can be a journey. Not all applications start at the same place in the journey...
21ST CENTURY SECURITY: Understanding High Security Contacts
It is apparent that many older specifcations for government and military security contacts were based...
Survey Results: Top 3 Applications for Packaging Machine Sensors
Packaging machinery builders are adapting to the times, and to the demands of their customers. As food,...
High-Speed SERDES Interfaces In High Value FPGAs
Lattice Semiconductor has introduced two low cost FPGA families with SERDES, the LatticeECP2M, introduced...
HIGH RELIABILITY MEMORY MODULE FEATURES, APPLICATIONS & ENVIRONMENTS
Viking Technology manufactures DRAM modules for OEMs in Enterprise, Telecommunications and Industrial...
POWER CONSIDERATIONS IN FPGA DESIGN
Power has always been a design consideration. Traditionally, though, a lower priority has been assigned...
Input Systems: Intuitive use makes all the difference
Machines simplify our everyday life in many different ways. But for this to work smoothly and for the...
WaveBolt™ System Discription
The WaveBolt™ system is a fixed wireless point-to-multipoint Internet access system designed specifically...
Validation and Deployment Concerns to Maintain Acceptable Risk
In order to ensure an acceptable level of residual risk has been achieved prior to deploying equipment...
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