Processors
ECC vs. Non-ECC MEMORY
Viking Technology manufactures DRAM modules for OEMs in Enterprise, Telecommunications and Industrial...
Accurately measuring efficiency of ultralow-IQ devices
While almost every power-supply engineer intimately knows and understands the lab setup for measuring...
Factorized Power Architecture and V•I Chips
As electronic systems continue to trend toward lower voltages with higher currents and as the speed of...
SynJet: Low-Power “Green” Cooling
The realities of finite petroleum resources and growing global energy needs along with the confidence...
350V to12V DC “Yeaman Topology” Power System
This paper introduces a new DC/DC power supply architecture, called “Yeaman Topology”. The main characteristic...
USING LOW COST, NON-VOLATILE PLDS IN SYSTEM APPLICATIONS
System designers are faced with continual pressure to meet their development schedules, and need to implement...
FPGAs in Next Generation Wireless Networks
In addition to voice connectivity, digital cellular wireless networks such as GSM and its enhancement,...
ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...
Enabling Multi-Host System Designs with PCI Express Technology
Although not part of the PCI Express spec, nontransparent bridging is completely consistent with it and...
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