Components
Signal Model Based Approach to Joint Jitter and Noise Decomposition
In this whitepaper, Rohde and Schwarz introduces a joint jitter and noise analysis framework for serial...
Updated Facts On 2015 HCFC-225 Usage Ban
Beginning January 1, 2015, HCFC-225 (also called “AK225”), a common precision solvent for high-end...
ENHANCING LONG-TERM RELIABILITY WITH COPPER LEADFRAMES
One of the points to consider when selecting a semiconductor device is the package reliability, relative...
NEW APPROACHES TO HARDWARE ACCELERATION USING ULTRA LOW DENSITY FPGAs
Ask system designers to list the problems they face – it doesn't matter whether they're building mobile...
DESIGNING FOR LOW POWER
Power consumption is becoming an increasingly important variable when it comes to calculating OPEX and...
THE NATURE OF WHITE RESIDUE ON PRINTED CIRCUIT ASSEMBLIES
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals...
Specifying a quartz crystal for a VCXO
A popular application for the voltage-controlled crystal oscillator is the forming of a phase-locked...
Reliability in Electronics
Most of us are familiar with the concepts of reliability and MTBF at a superficial level, without considering...
TAIYO YUDEN Lithium Ion Capacitors: An Effective EDLC Replacement
An accepted energy solution, conventional Electrical Double Layer Capacitors (EDLC) have many notable...
Implementing High-Speed DDR3 Memory Controllers in a Mid-Range FPGA
Implementing a highspeed, high-efficiency DDR3 memory controller in a FPGA is a formidable task. Until...
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